Electrical Conductive Adhesives with Nanotechnologies by Daniel Lu, C.P. Wong, Yi (Grace) Li (Hardcover, 2009)

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ISBN-13: 9780387887821, 978-0387887821. Electrical Conductive Adhesives with Nanotechnologies. The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF).

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Product Information

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Product Identifiers

PublisherSpringer-Verlag New York Inc.
ISBN-139780387887821
eBay Product ID (ePID)87842862

Product Key Features

Number of Pages437 Pages
Publication NameElectrical Conductive Adhesives with Nanotechnologies
LanguageEnglish
SubjectEngineering & Technology, Physics
Publication Year2009
TypeTextbook
Subject AreaMaterial Science, Mechanical Engineering, Nanotechnology
AuthorDaniel Lu, C.P. Wong, Yi (Grace) Li
FormatHardcover

Dimensions

Item Height235 mm
Item Weight1780 g
Item Width155 mm

Additional Product Features

Country/Region of ManufactureUnited States
Title_AuthorYi (Grace) Li, Daniel Lu, C.P. Wong

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