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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability by Thomas R. Bieler, Hongtao Ma, Choong-Un Kim, Tae-Kyu Lee (Paperback, 2016)
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ISBN-13: 9781489978011, 978-1489978011. This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Publisher: Springer-Verlag New York Inc., United States.
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Product Information
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.Product Identifiers
PublisherSpringer-Verlag New York Inc.
ISBN-139781489978011
eBay Product ID (ePID)229662695
Product Key Features
Number of Pages253 Pages
Publication NameFundamentals of Lead-Free Solder Interconnect Technology: from Microstructures to Reliability
LanguageEnglish
SubjectEngineering & Technology, Physics
Publication Year2016
TypeTextbook
Subject AreaMaterial Science
AuthorThomas R. Bieler, Hongtao Ma, Choong-Un Kim, Tae-Kyu Lee
FormatPaperback
Dimensions
Item Height235 mm
Item Weight559 g
Item Width155 mm
Additional Product Features
Country/Region of ManufactureUnited States
Title_AuthorHongtao Ma, Choong-Un Kim, Thomas R. Bieler, Tae-Kyu Lee
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