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Handbook of Silicon Wafer Cleaning Technology by Werner Kern (2nd Edition)
US $84.99
Approximately£64.04
Was US $99.99 (15% off)
Condition:
Good
A book that has been read, but is in good condition. Minimal damage to the book cover eg. scuff marks, but no holes or tears. If this is a hard cover, the dust jacket may be missing. Binding has minimal wear. The majority of pages are undamaged with some creasing or tearing, and pencil underlining of text, but this is minimal. No highlighting of text, no writing in the margins, and no missing pages. See the seller’s listing for full details and description of any imperfections.
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eBay item number:276739025604
Item specifics
- Condition
- ISBN
- 9780815515548
About this product
Product Identifiers
Publisher
Elsevier Science & Technology Books
ISBN-10
0815515545
ISBN-13
9780815515548
eBay Product ID (ePID)
64027504
Product Key Features
Number of Pages
660 Pages
Language
English
Publication Name
Handbook of Silicon Wafer Cleaning Technology
Subject
Electronics / Semiconductors, Electronics / Circuits / Integrated, Electrical, Electronics / Digital
Publication Year
2008
Type
Textbook
Subject Area
Technology & Engineering
Format
Hardcover
Dimensions
Item Height
1.7 in
Item Weight
40.2 Oz
Item Length
9 in
Item Width
6 in
Additional Product Features
Edition Number
2
Intended Audience
Scholarly & Professional
LCCN
2007-037151
Dewey Edition
23
Illustrated
Yes
Dewey Decimal
621.38152
Edition Description
Enlarged edition
Table Of Content
Part 1: Introduction and Overview Overview and Evolution of Silicon Wafer Cleaning Technology Overview of Wafer Contamination and Defectivity Part 2: Wet-Chemical Processes Particle Deposition and Adhesion Aqueous Cleaning and Surface Conditioning Processes Part 3: Dry Cleaning Processes Gas-phase Wafer Cleaning Technology Plasma Stripping and Cleaning Cryogenic Aerosols and Supercritical Fluid Cleaning Part 4: Analytical and Control Aspects Detection and Measurement of Particulate Contaminants Surface Chemical Composition and Morphology Ultratrace Impurity and Surface Morphology Analysis Analysis and Control of Electrically Active Contaminants Part 5: Directions for the Near Future
Synopsis
The second Edition of the Handbook of Silicon Wafer Cleaning Technolog y is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol, The 2nd Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included., The second Edition of the Handbook of Silicon Wafer Cleaning Technolog y is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.
LC Classification Number
TK7871.85.H338 2007
Item description from the seller
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